Paper
15 March 2006 First look at across-chip performance and process noise using non-contact performance-based metrology
Majid Babazadeh, Bertrand Borot, Wim Doedel, José Estabil, Jean Galvier, Gloria Johnson, Nader Pakdaman, Gary Steinbrueck, James Vickers
Author Affiliations +
Abstract
We report on the first non-contact, non-destructive performance measurements of embedded Ring Oscillators. Measurements are made on inside the die active area as early as Metal 1. A 90nm logic CMOS technology was used for this work. We have measured residual across-field performance process noise, and variation separate from and of opposite sense to wafer uniformity. This effect cannot be extrapolated from scribe measurements.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Majid Babazadeh, Bertrand Borot, Wim Doedel, José Estabil, Jean Galvier, Gloria Johnson, Nader Pakdaman, Gary Steinbrueck, and James Vickers "First look at across-chip performance and process noise using non-contact performance-based metrology", Proc. SPIE 6155, Data Analysis and Modeling for Process Control III, 615502 (15 March 2006); https://doi.org/10.1117/12.683362
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Semiconducting wafers

Metrology

Reticles

Oscillators

Manufacturing

Metals

Design for manufacturing

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