Paper
24 February 2006 Super slim optical pickup for mobile storage device applications
Sung-Dong Suh, Eunhyoung Cho, Haesung Kim, Yunwoo Nam, Jinseung Sohn, Myungbok Lee, Youngsuh Jin
Author Affiliations +
Abstract
This paper addresses the design, fabrication and packaging issues of SSOP(super slim optical pickup) module using blury technology. By using blu-ray technology, which uses a 407nm LD (Laser Diode) and an objective lens having NA (Numerical Aperture) 0.85, storage devices become miniaturized but have a high capacity. The developed prototype uses the integrated structure of a SiOB (Silicon Optical Bench) and a mirror substrate. The SiOB should be processed in order that a thin film PD(Photodiode) and interconnections, LD, Lens, QWP(Quarter Wave Plate) and HOE can be placed, and on the Silicon Substrate should Micromachined Silicon Mirror be formed. The SiOB is aligned and bonded with the wafer on which Silicon Mirror was formed. Then, it is diced. Because it is fabricated through this order, the super slim optical pickup can be fabricated by using wafer-level process. As a final step LD on the SiOB and HOE are mounted, assembled and bonded using an active alignment. The proposed SSOP was prototyped and characterized by measuring wavefront error and detecting static focusing and tracking error signals.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sung-Dong Suh, Eunhyoung Cho, Haesung Kim, Yunwoo Nam, Jinseung Sohn, Myungbok Lee, and Youngsuh Jin "Super slim optical pickup for mobile storage device applications", Proc. SPIE 6123, Integrated Optics: Devices, Materials, and Technologies X, 61231C (24 February 2006); https://doi.org/10.1117/12.645480
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Cited by 1 scholarly publication.
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KEYWORDS
Mirrors

Silicon

Semiconducting wafers

Integrated optics

Holographic optical elements

Reflectivity

Signal detection

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