Paper
16 February 2004 Self-crack-healing behavior under cyclic stress of silicon nitride composite at elevated temperature
Koji Takahashi, Shoko Yoshida, Kotoji Ando, Shinji Saito
Author Affiliations +
Proceedings Volume 5648, Smart Materials III; (2004) https://doi.org/10.1117/12.580717
Event: Smart Materials, Nano-, and Micro-Smart Systems, 2004, Sydney, Australia
Abstract
Si3N4/SiC composite ceramics were hot-pressed to investigate the crack-healing behavior under stress. Semi-elliptical surface cracks of 0.1 mm in surface length were made on each specimen. The pre-cracked specimens were crack-healed under cyclic or constant bending stress, and the resultant bending strength and cyclic fatigue strength were studied. The threshold stress for crack-healing was investigated at healing temperatures of 1000° and 1200°C. The cyclic fatigue strengths of crack-healed specimens were also investigated at healing temperatures of 900° and 1000°C. The main conclusions are as follows: (1) The threshold cyclic and constant stresses for crack-healing, below which pre-cracked specimens recovered their bending strength, were 300 MPa which was 75% of the bending strength of the pre-cracked specimens, and (2) The crack-healed specimens exhibited quite high cyclic fatigue strength at crack-healing temperatures of 900° and 1000°C.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Koji Takahashi, Shoko Yoshida, Kotoji Ando, and Shinji Saito "Self-crack-healing behavior under cyclic stress of silicon nitride composite at elevated temperature", Proc. SPIE 5648, Smart Materials III, (16 February 2004); https://doi.org/10.1117/12.580717
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KEYWORDS
Silicon carbide

Silicon

Ceramics

Composites

Reliability

Oxidation

Particles

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