Image Reversal Of Positive Photoresist A New Tool For Advancing Integrated Circuit Fabrication

Eric Ailing; Craig Stauffer

doi:10.1117/12.947835

18 April 1985 Image Reversal Of Positive Photoresist A New Tool For Advancing Integrated Circuit Fabrication

Eric Ailing, Craig Stauffer

Author Affiliations +

Proceedings Volume 0539, Advances in Resist Technology and Processing II; (1985) https://doi.org/10.1117/12.947835
Event: 1985 Microlithography Conferences, 1985, Santa Clara, United States

Abstract

In the struggle to attain denser and higher speed devices through reducing feature sizes companies are facing thresholds beyond which conventional photolithography cannot transcend. Enormous financial commitments have been made by semiconductor device fabricators in their drive to produce devices centered on 1.5μ design rules. The purchase of ever more sophisticated alignment and peripheral processing equipment, costly photoresist changes, and massive investments in engineering has enabled many companies to participate in this race. This compulsory buying of next year's model will not necessarily bring companies through the difficult technological times ahead!

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Eric Ailing and Craig Stauffer "Image Reversal Of Positive Photoresist A New Tool For Advancing Integrated Circuit Fabrication", Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); https://doi.org/10.1117/12.947835

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