Development of customer assistance software for alignment parameter optimization

Yuho Kanaya; Shinichi Nakajima

doi:10.1117/12.536104

29 April 2004 Development of customer assistance software for alignment parameter optimization

Yuho Kanaya, Shinichi Nakajima

Proceedings Volume 5378, Data Analysis and Modeling for Process Control; (2004) https://doi.org/10.1117/12.536104
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

Wafer alignment plays a significant role in the advancement of microlithography and has been constantly improved to meet various situations. As a result, its configuration is very dynamic and it sometimes requires considerable cost for process optimization. Software has been developed which evaluates the alignment performance in a variety of conditions from the minimal data set. It allows the user to perform off-line optimization, essentially reducing the amount of interruption toward production. This article illustrates the simulation method implemented in the software, OverLay EValuation program (OLEV).

Citation Download Citation

Yuho Kanaya and Shinichi Nakajima "Development of customer assistance software for alignment parameter optimization", Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); https://doi.org/10.1117/12.536104

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