Electronic properties of multiphase systems with varying configuration of inclusions

Vladimir V. Shchennikov; Sergey V. Ovsyannikov; Grigoriy V. Vorontsov; Vsevolod V. Shchennikov Jr.

doi:10.1117/12.523542

30 December 2003 Electronic properties of multiphase systems with varying configuration of inclusions

Vladimir V. Shchennikov, Sergey V. Ovsyannikov, Grigoriy V. Vorontsov, Vsevolod V. Shchennikov Jr.

Proceedings Volume 5342, Micromachining and Microfabrication Process Technology IX; (2003) https://doi.org/10.1117/12.523542
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States

Abstract

Multi-component systems (heterophases, layered, porous, misfit, composite) present the interest for different spheres of science and engineering. The paper covers both theoretical and experimental investigations of such systems with varying concentration and configuration of inclusions. En equations describing the dependence of electronic properties (thermomagnetic and galvanomagnetic as well as electrical and thermoelectric ones) of such systems on concentration and configuration of inclusions are presented. The equations derived may be used for analysis of electronic properties of advanced heterostructures. The above model describing the dependence of electronic properties of multi-component heterophase systems on concentration and configurations of inclusions allows to point out the ways for improving of electronic properties (thermoelectric effectiveness, thermoelectric and thermomagnetic figure of merit, etc.) and for extending of functional possibilities of such systems. So, the approach offered may be used for optimization of properties and for design of microdevices with improved characteristics. The work was partly supported by the Russian Foundation for Basic Research (RFBR), Gr. No. 01 - 02 - 17203.

Citation Download Citation

Vladimir V. Shchennikov, Sergey V. Ovsyannikov, Grigoriy V. Vorontsov, and Vsevolod V. Shchennikov Jr. "Electronic properties of multiphase systems with varying configuration of inclusions", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); https://doi.org/10.1117/12.523542

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