Laser applications in integrated circuits and photonics packaging

Yong Feng Lu; L. P. Li; K. Mendu; J. Shi

doi:10.1117/12.531758

15 July 2004 Laser applications in integrated circuits and photonics packaging

Yong Feng Lu, L. P. Li, K. Mendu, J. Shi

Proceedings Volume 5339, Photon Processing in Microelectronics and Photonics III; (2004) https://doi.org/10.1117/12.531758
Event: Lasers and Applications in Science and Engineering, 2004, San Jose, Ca, United States

Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.

Citation Download Citation

Yong Feng Lu, L. P. Li, K. Mendu, and J. Shi "Laser applications in integrated circuits and photonics packaging", Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); https://doi.org/10.1117/12.531758

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