Paper
30 March 2004 Ultralow-power ferroelectric memory for SoC
Author Affiliations +
Proceedings Volume 5274, Microelectronics: Design, Technology, and Packaging; (2004) https://doi.org/10.1117/12.530438
Event: Microelectronics, MEMS, and Nanotechnology, 2003, Perth, Australia
Abstract
The endurance of a FRAM is 1014 cycles with better retention times (>10 years). FRAM's have fast read/write access, low standby current, scalable and capable of ultra-low voltage operation. FRAM's share architectural features such as addressing schemes and I/O circuitry with other types of random access memories (DRAMs), but they have distinct features with respect to accessing the stored data, sensing, and overall circuit topology. The FRAM is a great advantage for SoC and wireless and mobile products, since it supports non-volatility but also delivers a fast memory access. Today's 1T/1C FRAM have an access time of 30 nS, a cycle time of 35 nS at 1.2 V power supply in a standard CMOS process with 2 mask adders. The cell size of a FRAM is comparable to that of a planar DRAM and is 3 - 4x denser than SRAM. This paper outlines the circuit innovations in embedded ferroelectric memories, and will cover the architecture, reference circuits, sense amplifiers, reliability issues and references to other memory technologies.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sreedhar Natarajan and Atila Alvandpour "Ultralow-power ferroelectric memory for SoC", Proc. SPIE 5274, Microelectronics: Design, Technology, and Packaging, (30 March 2004); https://doi.org/10.1117/12.530438
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KEYWORDS
Capacitors

Amplifiers

Dielectric polarization

Crystals

Ferroelectric materials

Ferroelectric capacitors

Polarization

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