EXTATIC: ASML's alpha-tool development for EUVL

Hans Meiling; Jos P.H. Benschop; Robert A. Hartman; Peter Kuerz; Peter Hoghoj; Roland Geyl; Noreen Harned

doi:10.1117/12.472308

1 July 2002 EXTATIC: ASML's α-tool development for EUVL

Hans Meiling, Jos P.H. Benschop, Robert A. Hartman, Peter Kuerz, Peter Hoghoj, Roland Geyl, Noreen Harned

Proceedings Volume 4688, Emerging Lithographic Technologies VI; (2002) https://doi.org/10.1117/12.472308
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

Within the recently initiated EXTATIC project a complete full-field lithography exposure tool for he 50-nm technology node is being developed. The goal is to demonstrate the feasibility of extreme UV lithography (EUVL) for 50-nm imaging and to reduce technological risks in the development of EUVL production tools. We describe the EUV MEDEA+) framework in which EXTATIC is executed, and give an update on the status of the (alpha) -tool development. A brief summary of our in-house source-collector module development is given, as well as the general vacuum architecture of the (alpha) -tool is discussed. We discuss defect-free reticle handling, and investigated the uses of V-grooved brackets glued to the side of the reticle to reduce particle generation during takeovers. These takeovers do not only occur in the exposure tool, but also in multilayer deposition equipment, e-beam pattern writers, inspection tools, etc., where similar requirements on particle contamination are present. Finally, we present an update of mirror fabrication technology and show improved mirror figuring and finishing results.

Citation Download Citation

Hans Meiling, Jos P.H. Benschop, Robert A. Hartman, Peter Kuerz, Peter Hoghoj, Roland Geyl, and Noreen Harned "EXTATIC: ASML's α-tool development for EUVL", Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); https://doi.org/10.1117/12.472308

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