Paper
31 May 1984 Quantitative Analysis Of Phosphosilicate Glass Films On Silicon Wafers For Calibration Of X-Ray Fluorescence Spectrometry Standards
Suzanne H. Weissman
Author Affiliations +
Abstract
The phosphorus and silicon contents of phosphosilicate glass films deposited by chemical vapor deposition (CVD) on silicon wafers were determined. These films were prepared for use as x-ray fluorescence (XRF) spectrometry standards. The thin films were removed from the wafer by etching with dilute hydrofluoric acid, and the P and Si concentrations in solution were determined by inductively coupled plasma atomic emission spectroscopy (ICP). The calculated phosphorus concentration ranged from 2.2 to 12 wt %, with an uncertainty of 2.73 to 10.1 relative percent. Variation between the calculated weight loss (summation of P2O5 and SiO2 amounts as determined by ICP) and the measured weight loss (determined gravimetrically) aver-aged 4.9 %. Results from the ICP method, Fourier transform-infrared spectroscopy (FT-IR), dispersive infrared spectroscopy, electron microprobe, and x-ray fluorescence spectroscopy for the same samples are compared.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Suzanne H. Weissman "Quantitative Analysis Of Phosphosilicate Glass Films On Silicon Wafers For Calibration Of X-Ray Fluorescence Spectrometry Standards", Proc. SPIE 0463, Advanced Semiconductor Processing/Characterization of Electronic/Optical Materials, (31 May 1984); https://doi.org/10.1117/12.941359
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KEYWORDS
Semiconducting wafers

Silicon

Phosphorus

Error analysis

Chemical analysis

Calibration

Etching

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