Paper
17 April 2001 In-situ STM study of copper deposition on Cu(111) single-crystal electrode in sulfuric acid solution
Wanda Polewska, M. R. Vogt, O. M. Magnussen, R. J. Behm
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Abstract
Results of an in-situ STM study of homoepitaxial copper electro deposition on Cu(111) in 0.01 M H2SO4 solution are presented which show a pronounced change in the growth and morphology of the deposit with increasing potential: while at - 0.40 V vs. SCE Cu multilayer growth is observed, Cu grows via a step-flow mechanism at -0.55 V. This behavior can be explained by the presence of an ordered sulfate adlayer at potentials >=-o.42 V, which causes a pronounced decrease in the Cu surface mobility.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wanda Polewska, M. R. Vogt, O. M. Magnussen, and R. J. Behm "In-situ STM study of copper deposition on Cu(111) single-crystal electrode in sulfuric acid solution", Proc. SPIE 4413, International Conference on Solid State Crystals 2000: Epilayers and Heterostructures in Optoelectronics and Semiconductor Technology, (17 April 2001); https://doi.org/10.1117/12.425437
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Cited by 2 scholarly publications.
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KEYWORDS
Copper

Scanning tunneling microscopy

Electrodes

Metals

Ions

Moire patterns

Atomic force microscopy

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