Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling

Wei Cui; Daniel P. Berg; James L. Drewniak; Richard E. DuBroff

doi:10.1117/12.445464

18 October 2001 Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling

Wei Cui, Daniel P. Berg, James L. Drewniak, Richard E. DuBroff

Author Affiliations +

Proceedings Volume 4394, Detection and Remediation Technologies for Mines and Minelike Targets VI; (2001) https://doi.org/10.1117/12.445464
Event: Aerospace/Defense Sensing, Simulation, and Controls, 2001, Orlando, FL, United States

Abstract

Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.

Citation Download Citation

Wei Cui, Daniel P. Berg, James L. Drewniak, and Richard E. DuBroff "Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling", Proc. SPIE 4394, Detection and Remediation Technologies for Mines and Minelike Targets VI, (18 October 2001); https://doi.org/10.1117/12.445464

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