Alignment performance as a function of chemical mechanical polishing techniques and stepper optimization

Bryan Hubbard; Albert H. Liu

doi:10.1117/12.346882

28 April 1999 Alignment performance as a function of chemical mechanical polishing techniques and stepper optimization

Bryan Hubbard, Albert H. Liu

Proceedings Volume 3741, Lithography for Semiconductor Manufacturing; (1999) https://doi.org/10.1117/12.346882
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

Optimized alignment for chemical mechanical polishing has been studied in detail to ascertain the best overall overlay and process conditions. This paper describes the methodology of alignment mark design and testing in conjunction with chemical mechanical polishing optimization for technologies of 0.35micrometers and below. The planarization of the substrate material by CMP combined with asymmetric metal deposition can cause linear alignment displacement. This study investigated chemical mechanical polish slurry types, hardware configuration, and process variables on general alignment conditions. Further study on alignment mark designs and photolithography stepper settings are investigated on a subset of optimized chemical mechanical polish conditions. An alignment condition where the result of less than 0.10 micrometers was obtained.

Citation Download Citation

Bryan Hubbard and Albert H. Liu "Alignment performance as a function of chemical mechanical polishing techniques and stepper optimization", Proc. SPIE 3741, Lithography for Semiconductor Manufacturing, (28 April 1999); https://doi.org/10.1117/12.346882

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