Failure modes in microelectronic packages

Xun Qing Shi; Wei Zhou; Hock Lye John Pang; Zhenfeng P. Wang

doi:10.1117/12.324385

28 August 1998 Failure modes in microelectronic packages

Xun Qing Shi, Wei Zhou, Hock Lye John Pang, Zhenfeng P. Wang

Author Affiliations +

Proceedings Volume 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV; (1998) https://doi.org/10.1117/12.324385
Event: Microelectronic Manufacturing, 1998, Santa Clara, CA, United States

Abstract

In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire method, is presented. It combines the features of the varied double projection moire method and the holographic interferometry method. This technique has been used to study the various failure modes, such as spallation, delamination, 1D buckle, 2D buckle, and crush, in microelectronic packaging film/substrate modules. The experimental phenomenon and fracture mechanism for various failure modes are presented and analyzed.

Citation Download Citation

Xun Qing Shi, Wei Zhou, Hock Lye John Pang, and Zhenfeng P. Wang "Failure modes in microelectronic packages", Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); https://doi.org/10.1117/12.324385

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