Application Of Wafer Probe Techniques To The Evaluation Of Projection Printers

C. P. Ausschnitt; T. A. Brunner; S. C. Yang

doi:10.1117/12.933555

13 September 1982 Application Of Wafer Probe Techniques To The Evaluation Of Projection Printers

C. P. Ausschnitt, T. A. Brunner, S. C. Yang

Author Affiliations +

Proceedings Volume 0334, Optical Microlithography I: Technology for the Mid-1980s; (1982) https://doi.org/10.1117/12.933555
Event: 1982 Microlithography Conferences, 1982, Santa Clara, United States

Abstract

As feature sizes and overlay tolerances shrink to keep pace with the increase in integrated circuit complexity, there is a concomitant need to advance the methods used to characterize and compare the performance of lithographic instruments. The electrical probe measurement technique has emerged as the most accurate, most effective approach to lithographic evaluation. We demonstrate the versatility of the technique as applied to state-of-the-art 1:1 projection printers. Among the characteristics of projection printers discussed are linewidth uniformity, focus and exposure latitude, pellicle mask protection, and distortion and alignment contributions to overlay accuracy.

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C. P. Ausschnitt, T. A. Brunner, and S. C. Yang "Application Of Wafer Probe Techniques To The Evaluation Of Projection Printers", Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); https://doi.org/10.1117/12.933555

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