Paper
5 June 1998 Transient thermal distortions of x-ray mask membranes during exposure scanning
Zhaohua Feng, Roxann L. Engelstad, Edward G. Lovell, Franco Cerrina
Author Affiliations +
Abstract
During x-ray lithography exposure scanning, intensive x-ray energy deposition in the mask membrane and absorbers causes thermal stresses and mask distortions. Transient heat transfer and thermal distortion models of the masks are presented in this paper. The x-ray beam, which has a Gaussian distribution in the vertical direction and is uniform in the horizontal direction, intermittently scans the pattern area in the vertical direction. The models were used to analyze the ARPA-NIST National x-ray Mask Standard with a 50 mm X 50 mm field size. Effects of exposure parameters are discussed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhaohua Feng, Roxann L. Engelstad, Edward G. Lovell, and Franco Cerrina "Transient thermal distortions of x-ray mask membranes during exposure scanning", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); https://doi.org/10.1117/12.309579
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Cited by 1 scholarly publication.
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KEYWORDS
Photomasks

X-rays

3D modeling

Finite element methods

X-ray lithography

Semiconducting wafers

Thermal modeling

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