Paper
24 October 1997 Novel multilayer optical interconnection architecture using fiber pins
Freddie Shing-Hong Lin, Guoda Xu, John M. Bartha, Tomasz P. Jannson
Author Affiliations +
Abstract
This paper presents a new low-cost, multi-layer interconnection architecture, which has the potential of being utilized in a space environment. Instead of conventional electrical input/output (I/O) pins, optical I/O pins are used to provide multi-layer interconnection. A small vertical cavity surface emitting laser diode array and photodetector array are used to transmit and receive signals, respectively. A specially fabricated end-face lensed fiber array is utilized to provide high-speed, low-loss, and low-crosstalk signal transmission. By employing this new optical I/O pin architecture, many types of standard multi-layer interconnection can be easily realized. This presentation covers the main concepts, major components, fabrication procedures, and expected applications of this architecture.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Freddie Shing-Hong Lin, Guoda Xu, John M. Bartha, and Tomasz P. Jannson "Novel multilayer optical interconnection architecture using fiber pins", Proc. SPIE 3159, Algorithms, Devices, and Systems for Optical Information Processing, (24 October 1997); https://doi.org/10.1117/12.284202
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Vertical cavity surface emitting lasers

Detector arrays

Optical fibers

Optical interconnects

Photodetectors

Sensors

Prototyping

RELATED CONTENT


Back to Top