Evaluating next-generation reticle demands on lithography equipment

Morihisa Hoga; Masahiro Nei; Ryuichi Ebinuma

doi:10.1117/12.277252

28 July 1997 Evaluating next-generation reticle demands on lithography equipment

Morihisa Hoga, Masahiro Nei, Ryuichi Ebinuma

Proceedings Volume 3096, Photomask and X-Ray Mask Technology IV; (1997) https://doi.org/10.1117/12.277252
Event: Photomask Japan '97, 1997, Kawasaki City, Japan

Abstract

Industry trends indicate that the next generation of exposure tool will be scanning steppers. Scanning steppers have a 25 mm by 33 mm field using 6 inch reticles. For device manufacturing, first generation 256M DRAM chips are roughly 12.5 mm by 25 mm, while 1G DRAM are expected to be 30 mm by 15 mm. As a result, a 25 mm by 33 mm field does not allow the exposure of two or more chips per shot. Therefore introduction of a larger mask is expected. To determine next generation reticle size standard, many factors have been investigated. First, an assumption was made that DRAM chip size trends will remain constant. Then, the throughput of scanning stepper was calculated with 6, 7, 8 and 9 inch reticles. The advantages were dependent on chip generation and device (memory or logic). Finally, a 9 inch reticle standard was chosen. Making the leap to a 9 inch reticle standard avoids the development time and costs of incremental changes in the standard. The thickness of a reticle is dependent upon reticle distortions, projection lens focus error. The deformation of the reticle has been simulated for the 0.25 to 0.5 inch thickness range. The final outcome of these simulations was that 9 mm (approximately 0.35 inch) was selected as the best thickness.

Citation Download Citation

Morihisa Hoga, Masahiro Nei, and Ryuichi Ebinuma "Evaluating next-generation reticle demands on lithography equipment", Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); https://doi.org/10.1117/12.277252

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