Paper
6 June 1997 Compact integrated piezoelectric vibration control package
Ronald L. Spangler Jr., Farla M. Russo, Daniel A. Palombo
Author Affiliations +
Abstract
Using recent advances in small, surface-mount electronics, coupled with proprietary packaging techniques, ACX has developed the SmartPackTM. The design and realization of this self-contained, active piezoelectric control device are described in this paper. The SmartPack uses a local control architecture, consisting of two parallel, analog, positive position feedback (PPF) filters, along with nearly collocated piezo strain sensors and actuators, to control multiple structural vibration modes. A key issue is the management of waste heat from the power electronics required to drive the piezo actuators. This issue is addressed through thermal/electrical modeling of the packaged amplifier. The effectiveness of the device is demonstrated through multi-mode active damping on a 24 inch square plate.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ronald L. Spangler Jr., Farla M. Russo, and Daniel A. Palombo "Compact integrated piezoelectric vibration control package", Proc. SPIE 3041, Smart Structures and Materials 1997: Smart Structures and Integrated Systems, (6 June 1997); https://doi.org/10.1117/12.275697
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Amplifiers

Electronics

Sensors

Actuators

Resistance

Control systems

Copper

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