Process optimization of single-coat positive photoresist for thick film applications

Alan E. Kozlowski

doi:10.1117/12.222639

26 September 1995 Process optimization of single-coat positive photoresist for thick film applications

Alan E. Kozlowski

Proceedings Volume 2640, Microlithography and Metrology in Micromachining; (1995) https://doi.org/10.1117/12.222639
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

This paper reports on a single coat process optimization of a new positive thick film resist originally described by Renaldo et al. from IBM at SPIE in 1995. The positive diazonapthoquinone photoresist system, SJR-3000, can achieve uniform coatings of greater than 28 microns in a single coat. In addition the process can produce images with wall profiles greater than 80 degrees and is compatible with traditional etch baths as well as gold, copper and permalloy plating baths without exhibiting cracking. Process latitude over a wide range exposure and development conditions will be demonstrated at a 20 (mu) coating thickness using a stepper exposure system.

Citation Download Citation

Alan E. Kozlowski "Process optimization of single-coat positive photoresist for thick film applications", Proc. SPIE 2640, Microlithography and Metrology in Micromachining, (26 September 1995); https://doi.org/10.1117/12.222639

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