Paper
27 July 1995 In-plane residual stress measurement with one axisymmetric phase-shifting holographic blind-hole fringe pattern
Chi-Tang Jeffrey Hsieh, Shyh Tsong Lin, Chih-Kung Lee
Author Affiliations +
Proceedings Volume 2577, International Conference on Applications of Optical Holography; (1995) https://doi.org/10.1117/12.215321
Event: International Conferences on Optical Fabrication and Testing and Applications of Optical Holography, 1995, Tokyo, Japan
Abstract
Theoretical and experimental investigation into the use of the holographic blind-hole method to measure residual stress is presented in detail. Under the specific optical configuration proposed in this paper, both maximal and minimal out-of-plane displacements can be directly obtained with a single axisymmetric measured fringe pattern. To increase the displacement measurement accuracy in order to facilitate the residual stress measurements of high strength/high stiffness materials, a phase-shifting technique was introduced into the hologrpahic setup. After careful data analysis and error analysis, the residual stress obtained experimentally was found to agree well with the theoretical residual stress results.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chi-Tang Jeffrey Hsieh, Shyh Tsong Lin, and Chih-Kung Lee "In-plane residual stress measurement with one axisymmetric phase-shifting holographic blind-hole fringe pattern", Proc. SPIE 2577, International Conference on Applications of Optical Holography, (27 July 1995); https://doi.org/10.1117/12.215321
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Cited by 3 scholarly publications.
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KEYWORDS
Fringe analysis

Phase shifts

Holography

Holographic interferometry

Curium

Ferroelectric materials

Phase measurement

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