Glass-on-chip package for CCDs

Maurice S. Karpman; Christopher Reiche

doi:10.1117/12.158593

27 September 1993 Glass-on-chip package for CCDs

Maurice S. Karpman, Christopher Reiche

Proceedings Volume 1999, Adhesives Engineering; (1993) https://doi.org/10.1117/12.158593
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States

Abstract

Electronic still cameras capture images with CCDs instead of silver halide film. However, the laws of optics continue to apply, and the active area of the CCD must be located in the focal plane of the camera optics. Typically, this means that the CCD is actively aligned during camera assembly. It is desirable to avoid this alignment operation. One way of circumventing alignment is to assemble the CCD in a package with a reference surface that is mechanically coupled to the surface of the CCD. This reference surface can then be mated to the camera optics, and alignment is automatic. We have developed a Glass-on-Chip package that uses optical adhesives to bond a shaped piece of glass directly to the surface of a CCD after wire bonding. If the glass thickness is controlled, this package meets the requirements for passive alignment of CCD to optics. Properties of the adhesive are critical to the success of this approach. The adhesive must be optically transparent, heat curable and compatible with the polymeric color filters already on the CCD.

Citation Download Citation

Maurice S. Karpman and Christopher Reiche "Glass-on-chip package for CCDs", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158593

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