Cost analysis of lithographic characterization: an overview

Patricia F. Mahoney; Chris A. Mack

doi:10.1117/12.150479

8 August 1993 Cost analysis of lithographic characterization: an overview

Patricia F. Mahoney, Chris A. Mack

Author Affiliations +

Proceedings Volume 1927, Optical/Laser Microlithography; (1993) https://doi.org/10.1117/12.150479
Event: SPIE'S 1993 Symposium on Microlithography, 1993, San Jose, CA, United States

Abstract

The traditional cost of ownership approach used in the semiconductor industry answers the question `How much does processing a test wafer increase the cost of product?' However, this approach does not directly answer the question `How much does it cost to process a test wafer?' A simple new cost of ownership model which answers this question, the Opportunity Cost Model (OCM), has been developed and is presented here. Background information on the OCM, the determination of opportunity costs, and the extra costs associated with test wafers are analyzed. Also, in an effort to quantify the costs associated with test wafer processing, a comparison of modeling and test wafer processing is presented.

Citation Download Citation

Patricia F. Mahoney and Chris A. Mack "Cost analysis of lithographic characterization: an overview", Proc. SPIE 1927, Optical/Laser Microlithography, (8 August 1993); https://doi.org/10.1117/12.150479

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