80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit

Timothy Yale Wittwer; Daniel M. Chester; John Gonzales

doi:10.1117/12.137776

12 August 1992 80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit

Timothy Yale Wittwer, Daniel M. Chester, John Gonzales

Proceedings Volume 1683, Infrared Focal Plane Array Producibility and Related Materials; (1992) https://doi.org/10.1117/12.137776
Event: Aerospace Sensing, 1992, Orlando, FL, United States

Abstract

Hughes Aircraft Company has successfully demonstrated accurate, high-throughput, automated cryogenic wafer-level testing of a 64 X 64 readout integrated circuit (ROIC) for use in the Army's Advanced Anti-armor Weapon System-Medium (AAWS-M) program (contract #DAAH01-89-C-A012). Data acquired from our cryogenic wafer prober is compared to data acquired utilizing a standard 68-pin dewar. ROIC noise, transimpedance, transimpedance linearity, slew rate, data valid time, operating speed, and dynamic range test data are presented. Delivery system flow diagrams are presented to show the streamlining effect of cryogenic wafer probing on the ROIC test flow.

Citation Download Citation

Timothy Yale Wittwer, Daniel M. Chester, and John Gonzales "80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit", Proc. SPIE 1683, Infrared Focal Plane Array Producibility and Related Materials, (12 August 1992); https://doi.org/10.1117/12.137776

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