Reflow soldering of fine-pitch devices using a Nd:YAG laser

Thomas J. Glynn; Aidan J.H. Flanagan; R. Michael Redfern

doi:10.1117/12.51040

1 December 1991 Reflow soldering of fine-pitch devices using a Nd:YAG laser

Thomas J. Glynn, Aidan J.H. Flanagan, R. Michael Redfern

Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51040
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

The drive towards miniaturization in electronics assembly has produced new devices with small lead pitch and high lead count which are difficult to bond reliably to substrates using conventional mass soldering technology. Micro-soldering using lasers has the potential to solve many of the problems involved. The results of Nd:YAG laser soldering trials on a ceramic chip with Kovar leads spaced at 0.025 in. are described. The results are compared with the predictions of a detailed finite-element thermal model of the systems and also with real-time thermocouple measurements of the temperature reached at specific locations during the soldering step. Implications for future work in this area are discussed.

Citation Download Citation

Thomas J. Glynn, Aidan J.H. Flanagan, and R. Michael Redfern "Reflow soldering of fine-pitch devices using a Nd:YAG laser", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51040

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available