Paper
1 February 2024 Study on the evolution law and microstructures of melted marks of H59 brass conductor under overcurrent failure
Xiaobo Yan, Yongfeng Zhang, Liyin Cao, Hao Huang, Renlie Bao, Cheng Hu, An Luo, Xin Lv
Author Affiliations +
Proceedings Volume 13068, Fifth International Conference on Optoelectronic Science and Materials (ICOSM 2023); 130681P (2024) https://doi.org/10.1117/12.3016333
Event: Fifth International Conference on Optoelectronic Science and Materials (ICOSM 2023), 2023, Hefei, China
Abstract
The overcurrent failure experiment device was used to prepare the overcurrent specimens of H59 brass conductor with thicknesses of 0.5mm and 0.8mm under 80A-100A and 100A-120A respectively. The evolution law of the temperature and microstructures of the specimens were studied. The results showed that: with the increase of overcurrent intensity, the heating rate of H59-0.5 and H59-0.8 were higher and showed a linear growth. Their critical current intensities for melting fracture were 100A and 110A respectively. At the critical current intensity (80A, 120A), the microstructures of them both were as-cast microstructure (plate-like α-phase dominant + small amount of isometric α-phase) and the α-phase showed orientation in the certain range and transcrystalline fracture at the fracture. Below the critical current intensity (100A, 110A), the metallographic structures of H59-0.8 were isometric α-phase with annealing twins and isolated β-phase. The average grain size was basically constant with the increase of the current intensity .At 90A, H59-0.5 was observed no obvious melted signs at macroscopic level but discovered localized melting marks which formatted typical widmanstätten structure under a high-powered optical microscope.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Xiaobo Yan, Yongfeng Zhang, Liyin Cao, Hao Huang, Renlie Bao, Cheng Hu, An Luo, and Xin Lv "Study on the evolution law and microstructures of melted marks of H59 brass conductor under overcurrent failure", Proc. SPIE 13068, Fifth International Conference on Optoelectronic Science and Materials (ICOSM 2023), 130681P (1 February 2024); https://doi.org/10.1117/12.3016333
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KEYWORDS
Fire

Copper

Alloys

Chemical composition

Temperature metrology

Annealing

Photomasks

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