Paper
6 November 2023 SiP design and simulation based on mentor graphics series software
Author Affiliations +
Proceedings Volume 12921, Third International Computing Imaging Conference (CITA 2023); 129211C (2023) https://doi.org/10.1117/12.2688282
Event: Third International Computing Imaging Conference (CITA 2023), 2023, Sydney, Australia
Abstract
With the continuous improvement of system performance and integration, the previous circuit design ideas based on PCB have gradually failed to meet the needs of system miniaturization, low cost and rapid development. SiP technology can integrate multiple bare dies or passive devices into a package to form a functional device. Compared with the traditional PCB technology, SiP technology has a strong advantage in volume, performance, confidentiality, the mature circuit module SiP, can be directly applied to the design of different models of products, greatly accelerates the development of the system. This paper briefly introduces the principles and related technologies of SiP design, and introduces the methods and steps of SiP design and simulation by using Mentor Graphics series software and considering related technology and manufacturability.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Han Gao and Hui Ma "SiP design and simulation based on mentor graphics series software", Proc. SPIE 12921, Third International Computing Imaging Conference (CITA 2023), 129211C (6 November 2023); https://doi.org/10.1117/12.2688282
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KEYWORDS
Design and modelling

3D modeling

Visualization

3D applications

Advanced packaging

Copper

3D vision

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