Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF)

Thomas Stoll; Tobias Feuerer; Alexander Hensel; Jörg Franke

doi:10.1117/12.2606382

4 March 2022 Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF)

Thomas Stoll, Tobias Feuerer, Alexander Hensel, Jörg Franke

Proceedings Volume 11992, Laser 3D Manufacturing IX; 1199203 (2022) https://doi.org/10.1117/12.2606382
Event: SPIE LASE, 2022, San Francisco, California, United States

Abstract

Additive Manufacturing technologies such as Laser Powder Bed Fusion (LPBF) provide several advantages compared to conventional manufacturing techniques by being cheaper, faster, more flexible and energy efficient. Therefore, they offer a huge potential for electronics packaging. Direct bonded copper substrates are a commonly used substrate technology for power electronics based on copper and alumina. This paper focuses on reflecting the state of the art in DBCtechnology by investigating the parameters different authors used in their experiments and deriving optimal settings based on these results. Furthermore, works addressing the LPBF of copper or laser-based copper processing on ceramics with and without afterward heat treatments were collected. These works were also studied and potentials, challenges as well as prospects for the LPBF-process of the adaption of the DBC-technology are presented.

Conference Presentation

Citation Download Citation

Thomas Stoll, Tobias Feuerer, Alexander Hensel, and Jörg Franke "Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF)", Proc. SPIE 11992, Laser 3D Manufacturing IX, 1199203 (4 March 2022); https://doi.org/10.1117/12.2606382

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