3D stacked sensor and detector using less than 5um-pich micro-bump connection

Makoto Motoyoshi

doi:10.1117/12.2567613

20 August 2020 3D stacked sensor and detector using less than 5μm-pitch micro-bump connection

Makoto Motoyoshi

Proceedings Volume 11494, Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XXII; 114940C (2020) https://doi.org/10.1117/12.2567613
Event: SPIE Optical Engineering + Applications, 2020, Online Only

Abstract

This paper presents the experimental results for a pixel detector device fabricated with 3.0-μm-diameter gold cone bump connections. The process integrity was checked for a test element group of a stacked heterogeneous X-ray sensor with gold cylindrical bumps.

Conference Presentation

Citation Download Citation

Makoto Motoyoshi "3D stacked sensor and detector using less than 5μm-pitch micro-bump connection", Proc. SPIE 11494, Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XXII, 114940C (20 August 2020); https://doi.org/10.1117/12.2567613

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