Surface strain analysis of bending polymer films for flexible electronics and soft robotics

Atsushi Shishido

doi:10.1117/12.2570544

25 August 2020 Surface strain analysis of bending polymer films for flexible electronics and soft robotics

Atsushi Shishido

Proceedings Volume 11477, Molecular and Nano Machines III; 1147702 (2020) https://doi.org/10.1117/12.2570544
Event: SPIE Organic Photonics + Electronics, 2020, Online Only

Abstract

Flexible electronics and soft robotics have been drawing much attention. However, prevention of fracture of materials and devices in three-dimensional deformation remains a challenge. Design of strain in the materials and devices enables durable high-performance materials and devices. In this study, surface strain analysis of bending polymer films by a novel method called a surface labeled grating method is introduced.

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Atsushi Shishido "Surface strain analysis of bending polymer films for flexible electronics and soft robotics", Proc. SPIE 11477, Molecular and Nano Machines III, 1147702 (25 August 2020); https://doi.org/10.1117/12.2570544

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KEYWORDS

Flexible circuits

Polymer thin films

Polymers

Robotics

Strain analysis

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