Low-power reconfigurable photonic integrated circuits fabricated by femtosecond laser micromachining (Conference Presentation)

Francesco Ceccarelli; Simone Atzeni; Francesco Pellegatta; Simone Piacentini; Andrea Crespi; Roberto Osellame

doi:10.1117/12.2544669

9 March 2020 Low-power reconfigurable photonic integrated circuits fabricated by femtosecond laser micromachining (Conference Presentation)

Francesco Ceccarelli, Simone Atzeni, Francesco Pellegatta, Simone Piacentini, Andrea Crespi, Roberto Osellame

Author Affiliations +

Proceedings Volume 11270, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX; 112700U (2020) https://doi.org/10.1117/12.2544669
Event: SPIE LASE, 2020, San Francisco, California, United States

Abstract

Femtosecond laser micromachining (FLM) is considered today a key technology for the fabrication of high-quality photonic integrated circuits, especially when a 3D geometry is required. However, when a thermal phase shifter is exploited to reconfigure an FLM device, its operation requires many hundreds of milliwatts. This issue strongly limits the scalability of these circuits. With this work, we present a new FLM fabrication process that takes advantage of thermally insulating microstructures (i.e. trenches and bridge waveguides) to demonstrate low propagation losses (0.29 dB/cm at 1550 nm), along with a power dissipation for a 2π phase shift down to 37 mW.

Conference Presentation

Citation Download Citation

Francesco Ceccarelli, Simone Atzeni, Francesco Pellegatta, Simone Piacentini, Andrea Crespi, and Roberto Osellame "Low-power reconfigurable photonic integrated circuits fabricated by femtosecond laser micromachining (Conference Presentation)", Proc. SPIE 11270, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX, 112700U (9 March 2020); https://doi.org/10.1117/12.2544669

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