Micro laser assisted single point diamond turning of brittle and hard materials

Hossein Shahinian; Jayesh Navare; Charan Bodlapati; Dmytro Zaytsev; Di Kang; Deepak Ravindra

doi:10.1117/12.2547009

2 March 2020 Micro laser assisted single point diamond turning of brittle and hard materials

Hossein Shahinian, Jayesh Navare, Charan Bodlapati, Dmytro Zaytsev, Di Kang, Deepak Ravindra

Proceedings Volume 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV; 112670Z (2020) https://doi.org/10.1117/12.2547009
Event: SPIE LASE, 2020, San Francisco, California, United States

Abstract

This article summarizes laser assisted single point diamond turning (SPDT) of select brittle and hard materials, using the μ-LAM process. These materials all have significant industrial importance in the modern day. It is shown that the μ-LAM process can produce smooth surfaces, with roughness values range from 40 nm RMS down to subnanometer RMS.

Conference Presentation

Citation Download Citation

Hossein Shahinian, Jayesh Navare, Charan Bodlapati, Dmytro Zaytsev, Di Kang, and Deepak Ravindra "Micro laser assisted single point diamond turning of brittle and hard materials", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 112670Z (2 March 2020); https://doi.org/10.1117/12.2547009

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