Critical defect detection, monitoring and fix through process integration engineering by using D2DB pattern monitor solution

Ming Tian; Yu Zhang; Tiapeng Guan; Jianghua Leng; Baojun Zhao; Lei Yan; Wei Hua; Abhishek Vikram; Guojie Chen; Hui Wang; Gary Zhang; Wenkui Liao

doi:10.1117/12.2511672

20 March 2019 Critical defect detection, monitoring and fix through process integration engineering by using D2DB pattern monitor solution

Ming Tian, Yu Zhang, Tiapeng Guan, Jianghua Leng, Baojun Zhao, Lei Yan, Wei Hua, Abhishek Vikram, Guojie Chen, Hui Wang, Gary Zhang, Wenkui Liao

Author Affiliations +

Proceedings Volume 10962, Design-Process-Technology Co-optimization for Manufacturability XIII; 109620L (2019) https://doi.org/10.1117/12.2511672
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

Abstract

Rigorous patterning control at critical wafer process steps of semiconductor fabrication is done to ensure integrity of the manufacturing process. At times, still with the entire existing process control infrastructure, we run into defect issues. Here we report an innovative methodology of Pattern Monitor that complements the existing approach and consistently detects critical defects on wafer that are hard to find using conventional wafer inspection tools. The unique integrated pattern centric approach puts this method apart from all the current inline tools. The Die-to-Database Pattern Monitor (D2DB-PM) solution has been applied to understand the evolution of pattern deformation through process integration engineering. A pattern centric engine is the key to this successful solution that is used to process large volumes of already existing Scanning Electron Microscope (SEM) images to perform Die-to-Database shape and critical dimension evaluation to detect deviations in the patterning behavior. This solution helped to resolve the limited Critical dimension (CD) measurement constraint that is otherwise associated with Critical Dimension Scanning Electron Microscope (CDSEM) measurement. In this paper we report the results from this innovative solution to detect process marginality and also verify the improved patterning behavior after the process fix is implemented.

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Ming Tian, Yu Zhang, Tiapeng Guan, Jianghua Leng, Baojun Zhao, Lei Yan, Wei Hua, Abhishek Vikram, Guojie Chen, Hui Wang, Gary Zhang, and Wenkui Liao "Critical defect detection, monitoring and fix through process integration engineering by using D2DB pattern monitor solution", Proc. SPIE 10962, Design-Process-Technology Co-optimization for Manufacturability XIII, 109620L (20 March 2019); https://doi.org/10.1117/12.2511672

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KEYWORDS

Scanning electron microscopy

Semiconducting wafers

Optical lithography

Defect detection

Etching

Image processing

Process control

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