Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning

Chi-Chun Liu; Richard Farrell; Kafai Lai; Yann Mignot; Eric Liu; Jing Guo; Yasuyuki Ido; Makoto Muramatsu; Nelson Felix; David Hetzer; Akiteru Ko; John Arnold; Daniel Corliss

doi:10.1117/12.2515862

26 March 2019 Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning

Chi-Chun Liu, Richard Farrell, Kafai Lai, Yann Mignot, Eric Liu, Jing Guo, Yasuyuki Ido, Makoto Muramatsu, Nelson Felix, David Hetzer, Akiteru Ko, John Arnold, Daniel Corliss

Author Affiliations +

Proceedings Volume 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019; 109580L (2019) https://doi.org/10.1117/12.2515862
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

Abstract

The progress of using DSA for metal cut to achieve sub-20nm tip-to-tip (t2t) critical dimension (CD) is reported. Small and uniform t2t CD is very challenging due to lithographic limitation but holds the key to backend-of-the-line (BEOL) scaling. An integration scheme is demonstrated that allows the combination of design flexibility and fine, rectified local CD uniformity (LCDU). Functional electrical testable Via-Chain structure is fabricated to verify the integrity of the proposed method. Through the analysis of the observed failure modes, the process is further improved. By validating DSA for such an important patterning element as metal cut, the DSA maturity can be further advanced and hopefully move DSA closer to HVM adoption.

Conference Presentation

Citation Download Citation

Chi-Chun Liu, Richard Farrell, Kafai Lai, Yann Mignot, Eric Liu, Jing Guo, Yasuyuki Ido, Makoto Muramatsu, Nelson Felix, David Hetzer, Akiteru Ko, John Arnold, and Daniel Corliss "Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning", Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 109580L (26 March 2019); https://doi.org/10.1117/12.2515862

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available