Efficient validation testing of Through-Silicon-Via (TSV) ASICs for CZT x-ray detectors

Daniel Violette; Branden Allen; Jae Sub Hong; Arkadip Basak; Jonathan Grindlay

doi:10.1117/12.2321694

13 September 2018 Efficient validation testing of Through-Silicon-Via (TSV) ASICs for CZT x-ray detectors

Daniel Violette, Branden Allen, Jae Sub Hong, Arkadip Basak, Jonathan Grindlay

Proceedings Volume 10762, Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XX; 107620S (2018) https://doi.org/10.1117/12.2321694
Event: SPIE Optical Engineering + Applications, 2018, San Diego, California, United States

Abstract

The High Resolution Energetic X-ray Imager (HREXI ) is a coded-aperture imaging telescope that utilizes a large closely-tiled array of CdZnTe (CZT) detectors, each 19.9 x 19.9 x 3mm with a 32 x 32 pixel (604μm) for coded aperture X-ray imaging (3 - 200 keV) of cosmic X-ray sources and transients. Each CZT crystal is read out by an ASIC incorporating, for the first time, Through Silicon Vias (TSVs). These TSVs replace the wire bonds for this ASIC, originally designed for the Nuclear Spectroscopic Telescope Array (NuSTAR) focusing hard X-ray telescope. The TSVs allow flip-chip bonding of the ASIC to the PCB board electronics for processing of the data. The new TSV-ASICs will enable closer tiling and larger imaging arrays which require faster, more efficient ASIC testing and calibration at the die level. We have designed and developed an ASIC Test Stand (ATS) for rapid ASIC testing prior to bonding to CZT. We demonstrate how ASIC die-level testing with the ATS can be performed rapidly with rigidly spaced micro-pogo pins supported by an FPGA readout.

Conference Presentation

Citation Download Citation

Daniel Violette, Branden Allen, Jae Sub Hong, Arkadip Basak, and Jonathan Grindlay "Efficient validation testing of Through-Silicon-Via (TSV) ASICs for CZT x-ray detectors", Proc. SPIE 10762, Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XX, 107620S (13 September 2018); https://doi.org/10.1117/12.2321694

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