Paper
14 May 2018 Hemispherical image sensor development for wide FOV imaging
Zhao Ma, C. Kyle Renshaw
Author Affiliations +
Abstract
Curved image sensors offer a new degree of freedom in optical system design that promise low-cost, small-volume solutions for wide field-of-view imaging. Stretchable polymer backplanes can provide the high-density of interconnects and tolerate the large deformations needed to transform planar, wafer-based image sensors into shapes with large nonzero Gaussian curvature. Here we demonstrate a thermoformable backplane based on glycolated polyethylene terephthalate (PETg) that can be deformed to a 98° spherical cap with 0.5” radius. We introduce a process to integrate such backplanes with a CMOS image sensor and release the circuit from the wafer to form a monolithically integrated image sensor that can be thermoformed to the desired shape.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhao Ma and C. Kyle Renshaw "Hemispherical image sensor development for wide FOV imaging", Proc. SPIE 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V, 106561Q (14 May 2018); https://doi.org/10.1117/12.2305051
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KEYWORDS
Semiconducting wafers

Etching

Image sensors

Polymers

Spherical lenses

Silicon

Wafer bonding

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