Presentation + Paper
22 February 2018 Challenges and solutions for high-volume testing of silicon photonics
Robert Polster, Liang Yuan Dai, Michail Oikonomou, Qixiang Cheng, Sebastien Rumley, Keren Bergman
Author Affiliations +
Proceedings Volume 10537, Silicon Photonics XIII; 1053703 (2018) https://doi.org/10.1117/12.2292235
Event: SPIE OPTO, 2018, San Francisco, California, United States
Abstract
The first generation of silicon photonic products is now commercially available. While silicon photonics possesses key economic advantages over classical photonic platforms, it has yet to become a commercial success because these advantages can be fully realized only when high-volume testing of silicon photonic devices is made possible. We discuss the costs, challenges, and solutions of photonic chip testing as reported in the recent research literature. We define and propose three underlying paradigms that should be considered when creating photonic test structures: Design for Fast Coupling, Design for Minimal Taps, and Design for Parallel Testing. We underline that a coherent test methodology must be established prior to the design of test structures, and demonstrate how an optimized methodology dramatically reduces the burden when designing for test, by reducing the needed complexity of test structures.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert Polster, Liang Yuan Dai, Michail Oikonomou, Qixiang Cheng, Sebastien Rumley, and Keren Bergman "Challenges and solutions for high-volume testing of silicon photonics", Proc. SPIE 10537, Silicon Photonics XIII, 1053703 (22 February 2018); https://doi.org/10.1117/12.2292235
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CITATIONS
Cited by 3 scholarly publications and 1 patent.
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KEYWORDS
Waveguides

Silicon photonics

Switches

Silicon

Calibration

Packaging

Photonic integrated circuits

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