Optimization for high speed surface processing of metallic surfaces utilizing direct laser interference patterning

Valentin Lang; Tim Hoffmann; Andrés Fabián Lasagni

doi:10.1117/12.2290320

19 February 2018 Optimization for high speed surface processing of metallic surfaces utilizing direct laser interference patterning

Valentin Lang, Tim Hoffmann, Andrés Fabián Lasagni

Author Affiliations +

Proceedings Volume 10520, Laser-based Micro- and Nanoprocessing XII; 105200K (2018) https://doi.org/10.1117/12.2290320
Event: SPIE LASE, 2018, San Francisco, California, United States

Abstract

Direct Laser Interference Structuring (DLIP) is a manufacturing technology capable to functionalize large areas with high-precision periodic patterns. However, for industrial use of this emerging technology, solutions must be developed for specific requirements. With the objective of optimizing Direct Laser Interference Patterning in terms of process speed, an advanced optical module was developed that permits to superimpose two laser beams obtaining the interference pattern within an elongated area (linear spot) to meet the requirements of high-speed processing. After that, the influence of the process parameters on the quality of the surface patterns produced with the developed optical assembly was determined. It could be shown that the pulse overlap, in contrast to the applied average fluence, has a significant influence on the resulting structure heights of the produced patterns. Furthermore, it became apparent that during the course of the process, the underlying physical process dynamics seem to change, which was indicated by the resulting structure heights variations over the process. The gained findings will make a contribution to improving the quality of surface patterns produced with DLIP and to enabling reliable manufacturing qualities in the future.

Citation Download Citation

Valentin Lang, Tim Hoffmann, and Andrés Fabián Lasagni "Optimization for high speed surface processing of metallic surfaces utilizing direct laser interference patterning", Proc. SPIE 10520, Laser-based Micro- and Nanoprocessing XII, 105200K (19 February 2018); https://doi.org/10.1117/12.2290320

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