DNA-assisted microassembly: a hetrogeneous integration technology for optoelectronics

Sadik C. Esener; Daniel M. Hartmann; Michael J. Heller; Jeffrey M. Cable

doi:10.1117/12.300616

27 January 1998 DNA-assisted microassembly: a hetrogeneous integration technology for optoelectronics

Sadik C. Esener, Daniel M. Hartmann, Michael J. Heller, Jeffrey M. Cable

Proceedings Volume 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review; 1029208 (1998) https://doi.org/10.1117/12.300616
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

The integration of optoelectronic and electronic components from different origins and substrates makes possible many advanced systems in diverse applications in photonics. To this end, various hybrid integration technologies including flip-chip bonding, epitaxial lift-off and direct bonding, substrate removal and “applique” bonding, microrobotic pick and place, and self-assembly methods have been explored. In this paper, we will briefly describe and evaluate these approaches for their applications in optoelectronics and focus on a new micro-assembly technology that can pick, place, and bond many devices of different origins and dimensions simultaneously in a parallel fashion on very large surfaces. We will present some of our preliminary results demonstrating the feasibility of this DNA-assisted micro-assembly technique.

Citation Download Citation

Sadik C. Esener, Daniel M. Hartmann, Michael J. Heller, and Jeffrey M. Cable "DNA-assisted microassembly: a hetrogeneous integration technology for optoelectronics", Proc. SPIE 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review, 1029208 (27 January 1998); https://doi.org/10.1117/12.300616

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