Application of line-scanning microscopy using a linear sensor in
semiconductor industry: shape and thickness measurements

Milton P. Macedo; C. M. B. A. Correia

doi:10.1117/12.2020244

13 May 2013 Application of line-scanning microscopy using a linear sensor in semiconductor industry: shape and thickness measurements

Milton P. Macedo, C. M. B. A. Correia

Author Affiliations +

Proceedings Volume 8788, Optical Measurement Systems for Industrial Inspection VIII; 87882H (2013) https://doi.org/10.1117/12.2020244
Event: SPIE Optical Metrology 2013, 2013, Munich, Germany

Abstract

This work aims at showing the applicability of a scanning-stage bench-microscope in bright-field reflection mode for wirebonding inspection of integrated circuits (IC) as well as quality assurance of tracks in printed circuit boards (PCB). The main issues of our laboratorial prototype arise from the use of a linear image sensor taking advantage of its geometry to achieve lower acquisition time in comparison to traditional (pinhole) confocal approach. The use of a slit-detector is normally related to resolution degradation for details parallel to sensor. But an improvement will surely arise using light distribution along line pixels of the sensor which establishes a great advantage in comparison to (pure) slit detectors. The versatility of this bench-microscope affords excellent means to develop and test algorithms. Those to improve lateral resolution isotropy as well as image visualization and 3D mesh reconstruction under different setups namely illumination modes. Based on the results of these tests tests both wide-field illumination and parallel slit illumination and detection configurations were used in these two applications. Results from IC wire-bonding show the ability of the system to extract 3D information. A comparison of auto-focus images and 3D profiles obtained using different 3D reconstruction algorithms as well as a method for the determination of the diameter of the bond wire are presented. Measurements of PCB track width and thickness were performed and the comparison of these results from both longitudinal and transverse tracks stress the limitations of a lower spatial sampling rate induced by the resolution of object stage positioners.

Citation Download Citation

Milton P. Macedo and C. M. B. A. Correia "Application of line-scanning microscopy using a linear sensor in semiconductor industry: shape and thickness measurements", Proc. SPIE 8788, Optical Measurement Systems for Industrial Inspection VIII, 87882H (13 May 2013); https://doi.org/10.1117/12.2020244

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
10 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Sensors

3D image processing

3D image reconstruction

Image sensors

Algorithm development

Reconstruction algorithms

3D metrology

Show All Keywords

Keywords/Phrases

Search In:

Publication Years